N308
Located in White Bear Lake, MN
Job Full Description
Job Description: We are seeking a detail-oriented and skilled Wafer Dicing/Lapping Technician to join our team. The Wafer Dicing/Lapping Technician will be responsible for operating and maintaining equipment used in the dicing and lapping of semiconductor wafers. This role requires precision, technical expertise, and a keen eye for detail to ensure the highest quality standards.
Key Responsibilities:
- Operate and maintain wafer dicing and lapping equipment, ensuring optimal performance and precision.
- Perform periodic checks and maintenance on equipment to ensure reliability and accuracy.
- Inspect processed wafers for defects or deviations from quality standards using microscopes and specialized software.
- Record and document production data and process parameters for quality control and traceability.
- Collaborate with quality assurance teams to implement improvements in the dicing and lapping processes.
- Follow safety protocols and maintain a clean and safe working environment.
Qualifications:
- High school diploma or equivalent; additional technical training or certification is a plus.
- Previous experience in wafer dicing, lapping, or a related field is preferred.
- Strong attention to detail and ability to work in a cleanroom environment.
- Good communication skills and ability to work as part of a team.
- Willingness to work flexible hours, including evenings, weekends, and holidays as needed.
Benefits:
- Competitive salary and benefits package.
- Opportunities for professional growth and development.
- Collaborative and innovative work environment.
Woodbury, MN
3394
650 Commerce Drive
Suite 135
Woodbury, MN 55125
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